The unified wafer management system gives the Spartan™ Sorter the minimum scale and complexity required to accomplish its core job: to move wafers as cleanly and as quickly as possible. The Spartan Sorter offers improved reliability and maximized efficiency while delivering industry-leading cleanliness with the lowest particle levels.
Ease of set-up and serviceability are key attributes of the Spartan Sorter. Its simple, scalable architecture is easy to service and maintain. Fully compliant with SEMI standards, the Spartan Sorter is available in several options to support various sorting applications.
The Spartan Sorter offers improved reliability and maximized efficiency while delivering industry-leading cleanliness with the lowest particle levels.
Maximum Productivity & Profitability
- Optimized mini-environment delivers best-in-class cleanliness with better than ISO Class 1 performance
- Dual, ultra-thin edge-grip wafer handling achieves fast swap time performance for the most demanding applications
- Rectilinear-motion wafer engine provides simpler, more reliable setup and troubleshooting
- Flexible, configurable design and advanced software support reduced cycle times and allow easy integration, serviceability, and maintainability
The Spartan Sorter delivers industry-leading particle performance and low cost of ownership driven by its high reliability, serviceability, and maintainability. With more than 1,200 systems installed in high-volume manufacturing applications, the Spartan Sorter is a proven platform for wafer handling.
Spartan Enerta Option
Using pure, ultra-clean nitrogen, the Spartan Enerta™ Purge Option is able to achieve relative humidity below 5% within 85 seconds for incoming FOUPs, making it the fastest N2 purge in the industry. It protects the wafers from O2 and H2O exposure, preventing native oxide growth and corrosion of copper interconnects while reducing the impact of chemical residue that could react with water vapor and create additional damage. It also reduces the impact of critical timing between process steps by reducing exposure to oxygen and water vapor.
The Spartan Enerta is a combination front opening unified pod (FOUP) nozzle purge and door purge. The door purge combines a top and side manifold that allows it to maintain purge with the door open and while wafers are moving in and out of the FOUP. Careful gas management and flow control enable a rapid purge while eliminating the particle contamination associated with conventional purging technologies. The system uses advanced recipe-controlled purging that provides complete user control over ramp and flow rates — all under full manufacturing execution system (MES) control.
Chemical Filter Option for Spartan
The Chemical Filter Option for Spartan addresses the issue of airborne molecular contamination (AMC), which, due to its microscopic size, is able to penetrate standard cleanroom filters. This causes a number of process yield and reliability issues, particularly at the 32nm node and below. The use of this option eliminates AMC and provides filtered air in the mini-environment to ensure the wafers stay clean between FOUPs.
Spartan Low Contact Backside End Effector
The Spartan Low Contact Backside End Effector achieves industry-leading cleanliness to eliminate backside particles, which are increasingly impacting process performance as manufacturing nodes shrink. The Low Contact Backside End Effector eliminates the migration of edge or backside particles onto the active portion of the wafer to reduce defectivity.