Wafer Fast Swap Vacuum Robot for Heavy Payload & Small Containment Applications
The dual arm MagnaTran® 8 Radius™ robot extends the benefits of MagnaTran field-proven direct drive technology to a tri-axial drive. In addition, the MagnaTran leverages proven SCARA arm technology to provide sub 4 second fast swaps within a small containment diameter. Both the tri-axial drive and the arm have been designed to accommodate heavier payloads.
The direct magnetic drive technology improves reliability by reducing the number of parts and eliminating the need for a dynamic seal for vacuum isolation. Elimination of the dynamic seal reduces friction, wear, tear and torque resulting in fewer failures. Elimination of stepper motors and/or transmission coupling mechanisms reduces vibration, particles, backlash and increases positional repeatability.
The fast swap arm, Time Optimal Trajectory™, continuous rotation and direct drive servo, with Brooks proprietary DSP controller provides higher throughput.
Key Features
- High capacity direct drive technology with no dynamic seals, drive belts or cables
- Proven > 12.8 Million MCBF reliability
- Controls located in a remote enclosure up to 15 feet away from the drive
- Patented Time Optimal Trajectory®
- User-programmable robot access zones
- CE and SEMI S2 compliant
Benefits
- High reach-containment ratio
- Fast swap
- High payload capacity
- Low cost of ownership
- UHV compatibility
- Wafer & equipment safety
- Global Service Organization
- Meets international design and industry safety standards
User-programmable safety zones prevent possible collision during manual operation thus ensuring the safety of high-value wafers and process equipment. Comprehensive diagnostics are accomplished via a graphical user interface at a remote, modem linked service terminal. Error logging with prior events is time and date stamped.
Cycle counters are stored in non-volatile memory and critical performance characteristics are monitored and reported graphically. Multi-Sensor interfacing is accomplished via high speed PIO that enables direct interface to substrate sensors and other peripheral modules such as valves. Real-time information allows position referencing by edge sensing of moving components. The wafer presence may be referenced in macro sequences for safety purposes.
