300mm Robot Alignment Tool (RC-3003)

RC-3003 Robot Alignment Tool 430w

Stop “eyeball” alignments! Brooks ALIGN™ series of alignment tools provide a fast, repeatable and highly accurate method of aligning your wafer handling equipment — from wafer sorters and inspection tools to cluster tools and equipment front ends. Increase your yield and throughput through more accurate alignments while saving up to 75% of the time required by “eyeball” alignments.

The RC-3003 Robotic Alignment Tool uses optical non-contact measurement sensors to analyze robotic motion. The motion of the wafer is characterized in slots 1-5 and 21-25 in five axes: X, Y, Z, RX, and RY. Using on-screen instructions and “real time” graphical displays, the technician can make accurate adjustments to the machine setup. Numerical readouts provide statistical analysis, while Pass/Warn/Fail labels allow for fast, simple inspection of robots.


  • On-screen instructions provide intuitive operation.
  • “Real Time” Display screens provide fast and accurate robot setup and adjustments.
  • Optical non-contact measurement sensors analyze robotic motion.
  • Wafer motion is characterized in 5 degrees of freedom: X, Y, Z, RX, & RY.
  • Compatible with 5-finger end effectors.
  • Measures a wafer in slots 1-5 and 21-25
  • Bubble screen provides intuitive display of platform or wafer pitch and roll.


  • Improve wafer handling.
  • Save maintenance time.
  • Reduce MTTR.
  • Increase MTBF.
  • Reduce particulation and increase yield.
  • Eliminate wafer scratching.


  • Non-subjective and highly repeatable sensors replace the traditional “eyeball” alignment
  • Full 5-axis alignment in slot 1-5 and 21-25.
  • Intuitive display guides operator to correct robot position for X, Y, Z, rX, and rY (height, rotation, extension, pitch, and roll)
  • Easy to read real-time display allows platform leveling
  • Can be used to check or teach alignment
  • Self-contained unit is battery operated
  • Windows® CE-based controller provides power and flexibility
  • On-board data logging capability
  • SEMI-compatible profile assures interface with nearly all wafer handling equipment.
  • Drop-in replacement for FOUP in most equipment.
  • Power required: 110/220-volt charger (included)
  • Part size: 355mm x 455mm x 355mm (14" x 18" x 14")
  • Part weight: 10 kg (22 lb)